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Technology Oct 8, 2026 1 min read

Semiconductor Packaging Boom Ignites Fully Automatic Transfer Molding Equipment Market

QY Research has released a new report forecasting the global fully automatic transfer molding equipment market from 2026 to 2032, driven by rising demand in semiconductor packaging. The report provide…

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Business Oct 5, 2026 1 min read

E&r Engineering to Launch New Malaysia Plant: Expanding Global Packaging Materials Production and Localized Services

KAOHSIUNG, Oct. 4, 2026 /PRNewswire/ -- E&R Engineering Corp., (TWSE: 8027) an international provider of semiconductor packaging equipment, announced today the upcoming grand opening of its new Malays…

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